PCB Assembly

Full System Assembly

Testing Services

PCB Assembly Services

EMSYDEL specialize in low-to-medium volume, high mix, high complexity mixed technology (SMT and Through Hole) placement, including ball-grid-array (BGA), COB and Flip-Chip. EMSYDEL offers its customers both in-circuit and functional testing from its locations in Bangalore, INDIA. It utilises the ISO 9002 quality programmes that include development of customer-specific product quality management plans. These feature a closed-loop corrective action system to resolve customers issues. EMSYDEL has the capability to handle the following technologies.

Plastic / Ceramic BGA / Micro BGA, Column Grid Arrays

Chip Scale Packages, Fine Pitch QFPs and PLCCs, 0402SMT devices

Direct Chip Attach, Chip on Flex, Chip on Board, Single Pass Flip Chip

EMSYDEL ensures that the materials used adhere to the tough global environmental standards by ensuring the following:

Conventional Lead-FREE Soldering

Conductive Adhesives

In-house conformal coating and potting

Substarters

FR4, CEM1, Polyamide / FLEX, Teflon, Ceramics

Quick Check
Please enter the details here to find out how best we deliver solutions for your organisation